Pin and Plating Material

Pin Materials:

Brass, Beryllium Copper, Copper, Phosphorous Bronze, Cutting Steel, Stainless Steel, Carbon Steel, Aluminum Alloy etc.

 

Plating Processes that can be found are:

Copper (Cu), Nickel / Electroless Nickel (Ni/ENi), Bright Tin ( Bright Sn), Matte Tin (Matte Sn), Tri-metal (Cu/Sn/Zn), Silver (Ag), Nickel-Tin (SnNi), Palladium (Pd), Platinum (Pt), Gold (Au)(Barrel & Rack – PCB and GC)

 

Plating Base Material that can be found are:

Steel, Steel Alloy (Fe+Co+Ni), Brass, Copper, Copper Alloy, Aluminum, Aluminum Alloy, Stainless Steel, Zinc, Zinc Alloy, Ceramic

 

端子材料:黄铜,铍铜,铜,磷青铜,切削钢,不锈钢,碳钢,铝合金等。

电镀工艺可以找到的是: 铜, 镍/无电解镍, 亮锡, 雾锡(哑光锡), 三金属, 银, 镍锡, 钯, 铂, 金(桶和机架 – PCB和GC)